Developments

Overview of Developments

1995

• Vapour Phase Reflow Soldering Systems VP32 / VP53 / VP56 as Batch type systems for small and medium manufacturing volume.

1996

• VP 56-SI Inline-Vapour Phase Soldering System for application in automatic manufacturing lines with an average throughput.
• Desoldering System, usable with all ASSCON Vapour Phase Soldering Systems.
• OPC (Optical Process Controlling)

1997

• Fundamental development of the 3rd generation. It first appeared that the heat transfer in the vapour is affectable. External pre-heating is not necessary any more.
• Inline Soldering System VP2000 for application for large-batch production.

1998

• TGC (Temperature Gradient Controlling) Simple and flexible pre-selection of the temperature gradient.
• ASB (Automatic Solder Break) Automatic recognition of a finalized soldering process.
• Non-stick coating for the boiling tank for a facilitated cleaning.

1999

• First applications with ASSCON Systems in “Lead Free Soldering Technology“
• Laboratory Soldering System Quicky 300
• Invention of the Vapour Phase Vacuum Soldering Process

2000

• Fundamental development of Vapour Phase Vacuum Reflow Soldering Systems. The patent for Vapour Phase Vacuum Soldering Method is granted.
• Laboratory Soldering System Quicky 450

2001

• Worldwide first Vacuum Reflow Soldering System VP6000 for series manufacture.
• Worldwide first Inline Vacuum Reflow Soldering System VP2000 vacuum for high volume production.

2002

• Series production application of Lead Free Soldering Technology with Vapour Phase Soldering Systems
• VP 1500 for processing of assemblies with a size of maximal 1500mm

2003

• Complete automation of Vacuum Soldering System for power modules with Lead Free Technology
• Redesign of VP2000 inline

2004

• Presentation of the redesigned Inline Machine Generation VP2000 inline for a flexible high volume production.

2005

• Working on a redesign of all batch systems
• Launching a new medium sized in-line system

2006

• Launching of a new laboratory system VP800
• Redesign and further development of the VP6000
• Certification of the Quality Management according to DIN EN ISO 9001/2000

2007

• Development and launching of the VP1000-180 as vapour-phase-soldering-system for special board sizes up to 1000x800mm
• Development and launching of the VP1000-44, -64 and -66 as new batch-line for small and medium sized series
• Redevelopment and launching of the VP6000vacuum as vacuum-soldering-system for small and medium sized serial production
• Redevelopment of the system control with ETR (ENERGY-TRANSFER-RATE)

2008

• Development and launching of the ASSCON data collection-software
• Qualification and certification of the first vapour-phase-soldering-systems for mass-production and laboratory according to the UL- and CSA-standards
• Assembling of the so far biggest ASSCON vapour-phase-soldering-system VP2000XL (length of the system 5,5m) as a customized research & development-project for mass-production
• Development of automatic adjustment of temperature gradients especially for vapour-phase-soldering-systems successfully completed (German Patent DE101 59 057; granted May, 7, 2009)

2009

• Development and launching of the VP800vacuum
• Development and launching of the Inline Automation Module for VP1000 and VP6000vacuum-soldering systems
• Development and launching of Inline system VP2000 on a complete new platform
• Successful Re-Certification of the Quality Management according to DIN EN ISO 9001/2008

top