Desoldering System

Deutsch

Laboratory

Series Manufacture

Large Production

Supplementary Products

Desoldering

Heat Transfer Medium

Data collection

Concept

The ASSCON-desoldering system for the use in vapor-phase soldering machines. Multi-leaded SMD-components, ballgrid-arrays, connectors as well as mechanical components may be desoldered correctly and safely.

Advantages

Easy to operate
Economical: purchase and operation
May be used with every vapor-phase soldering machine
No damage to components or PCB tracks
Oxidation-free process during reflow
No over-heating of the component to be desoldered or the assembly
No wearing parts
Reproducible process conditions
After installing a new positioning pin the desoldering system is immediately operational
Neither special nozzles nor tools needed for different component forms
Lead-free products may be repaired without problems

Desoldering System product sheet.pdf
Desoldering System technical data.pdf

For further informations please download our product sheet and our technical data in Adobe PDF-format. To read a PDF-file you need the Adobe Acrobat Reader which you can download from the Adobe website for free.

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