VP 6000 vacuum

Machine Design

ASSCON's vacuum soldering process combines the average of the vapor-phase with the vaccum process. The vaccum module consists of the evacuation unit mounted in the process chamber where it is secured with quick-locks for fast and easy removal for maintenance. Pump, valves and sensors are integrated in the base.

conventionally soldered		vacuum soldered

Typical Applications

• Soldering of cased power components on printed circuit boards
• Area reflowing of components on heat-sink plates
• Soldering of power chips on base substrate with paste or solder foils
• Hermetic soldering of high frequency penetrations
• Making solder connections of large area electrical and mechanical components
• Elimination of voids with through-holes or other leaded connections for components to improve heat sinking
• Reflowing of large area SMTs or connectors on multilayers
• Repair of SMTs or conventional connectors in high-multilayers
• Simultaneous soldering of active and power components
• Soldering of 3D assemblies

VP6000 vacuum product sheet.pdf
VP6000 vacuum technical data.pdf

For further informations please download our product sheet and our technical data in Adobe PDF-format. To read a PDF-file you need the Adobe Acrobat Reader which you can download from the Adobe website for free.

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• User-friendly in-line SMT reflow soldering system
• Oxygen-free-process, oxygen-free pre-heat and soldering process
• Lead-free capable without restriction
• Optimum process reliability with TGC, ASB and ETR

• ASB (automatic-solder-break), automatic recognition of the completed soldering process
• TGC (temperature-gradient-control), adjustable Temperature gradients in the pre-heating zone
• OPC (optical-process-control), visual process control
• Storage of soldering programs
• Low operating costs through efficient energy use