ASSCON vapour-phase reflow soldering systems are state-of-the art. They are the innovative response to modern soldering challenges. The physical principles of the process allow fault-free soldering of the most complex SMT modules in lead-free soldering pastes in virtually any arrangement.
ASSCON’s vacuum soldering process combines the advantages of the vapourphase with the vacuum process. Power components require a homogeneous metallic connection with the PCB to transfer the required current. Assemblies soldered in ASSCON’s vacuum process exhibit greatly improved solder joints relative to void formation. Particularly when using lead-free solders the wetting properties decrease and the solder joints exhibit an increased occurrence of voids and entrapments.
Evacuation unit
Machine Conception
As the processing zone is separated from the vacuum module and cooling zone, it is possible to apply the soldering process in the VP 800 vacuum system to the standard achieved by current production lines in a compact environment. Here, the system especially stands out by virtue of its simple handling, enabling each user to solder high-quality modules fault-free.
VP800 vacuum
product sheet.pdf
VP800 vacuum
technical data.pdf
For further informations please download our product sheet and our technical
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- User-friendly reflow soldering system
- Effective vacuum unit
- Adjustable vacuum ensures ideal void-free solder joints
- Automatic fluid identification
- Continuously adjustable temperature gradient
- Oxygen-free preheating and soldering process
- Lead-free soldering pastes can be used without limitation
- Optional fluid filter system including pump
Optimum process reliability through:
- ASB (automatic-solder-break), automatic detection of the terminated soldering process
- TGC (temperature-gradient-control), selectable temperature gradients in the preheating zone
- OPC (optical-process-control), visual process control