VP 800 vacuum

ASSCON vapour-phase reflow soldering systems are state-of-the art. They are the innovative response to modern soldering challenges. The physical principles of the process allow fault-free soldering of the most complex SMT modules in lead-free soldering pastes in virtually any arrangement. ASSCON’s vacuum soldering process combines the advantages of the vapourphase with the vacuum process. Power components require a homogeneous metallic connection with the PCB to transfer the required current. Assemblies soldered in ASSCON’s vacuum process exhibit greatly improved solder joints relative to void formation. Particularly when using lead-free solders the wetting properties decrease and the solder joints exhibit an increased occurrence of voids and entrapments.

Quicky450 Kühlgerät und SchaltschrankEvacuation unit

Machine Conception

As the processing zone is separated from the vacuum module and cooling zone, it is possible to apply the soldering process in the VP 800 vacuum system to the standard achieved by current production lines in a compact environment. Here, the system especially stands out by virtue of its simple handling, enabling each user to solder high-quality modules fault-free.

VP 800 vacuum product sheet.pdf
      VP 800 vacuum technical data
Multivacuum product sheet.pdf

For further informations please download our product sheet in Adobe PDF-format. To read a PDF-file you need the Adobe Acrobat Reader which you can download from the Adobe website for free.


VP 800 vacuum at a glance

Optimum process reliability through: