Machine Design
The machine is impressive due its simplicity, ease of use and through providing
the ability to solder high quality assemblies defectfree. Due to the small
dimensions of the machine and its independence of fixed supply systems, the
unit may be used at different workplaces without restrictions.
Entering
the assembly
Typical Process Applications
- Laboratory use to qualify and to test soldering processes
- Dependable SMT-soldering of single assemblies
- Qualtiy-control of solder pastes and printed circuit boards
- Repair of assemblies, desoldering and resoldering of components
Quicky 300
product sheet.pdf
Quicky 300
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- laboratory reflow soldering system
- Mobile and usable for
- Repair of Assemblies
- Quality control
- Oxygen-free-process, oxygen-free pre-heating and soldering process
- Lead-free capable without restrictions and with regard to choice of
temperature gradient
Optimal Process Consistency because of:
- ASB (automatic-solder-break), automatic recognition of the completed
soldering process
- TGC (temperature-gradient-control), Temperature gradients in the pre-heating
zone
- OPC (optical-process-control), visual process control