
VP7000 vacuum inline
High-Performance inline systems for large series
Features
The concept

Full inline integration and no need for workpiece carriers, this is the focus of ASSCON´s vapor phase inline soldering systems. The simple transfer and takeover of PCBs via pin chains characterize this type of inline system. Electrically width-adjustable transport systems allow fast and uncomplicated adaptation to changing products and thus offer the flexibility required in today’s modern electronics production. The integration into inline control computers is also possible. Full automation combined with the highest quality in the process is the guiding principle here.
With the patented Multi Vacuum technology, voids in solder joints are reduced and void rates <1% are achievable. The vacuum module, which can be switched on during the process, is located outside the soldering area (Clean Vacuum Technology) and is therefore extremely low in maintenance.
The VP7000-200 in 30 sec
Details
Transportation type
Single Lane
Maximum solder length
155 mm - 520 mm (see details)
Maximum solder width
up to 450 mm
Maximum component height at top
55 mm
Maximum component height below
20 mm
Connection load
21,1 kW
Average energy consumption
4,7 kW
Time to operation
ca. 45 min
possible loading according to solder length
Loading 2 PCBs: up to 520 mm
Loading 3 PCBs: up to 335 mm
Loading 4 PCBs: up to 250 mm
Loading 6 PCBs: up to 155 mm
Option Longboard: up to 1.040 mm
VP7000-200 in the production



