Desoldering System

The concept

The ASSCON desoldering system for use in vapor phase soldering systems. Multi-pole SMD components, ball grid arrays, connector strips as well as mechanical elements can be desoldered gently and safely.

The benefits

Easy handling

No wear parts

Economical

Can be used in any vapor phase soldering system

No damage to components or conductor paths

Oxidation-free process during the melting process

Uniform stress-free heating of the module

No overheating of the component or assembly to be desoldered

Reproducible process conditions

The desoldering system is immediately ready for use again after inserting a new fixing pin.

No special nozzles and tools are required for different component shapes.

The repair of lead-free products is possible without any problems