Desoldering Carrier

The concept

The ASSCON desoldering carrier has been developed for use in vapour phase soldering systems. As a further development of the desoldering system, which is also available, the desoldering carrier is available in two different sizes. It can be used to desolder components from up to 24 PCBs simultaneously. SMD components, ball grid arrays, connector strips and mechanical elements can be desoldered gently and safely.

The benefits

Flexible

Easy handling

No wear and tear

Economical

Can be used in any vapour phase soldering system

No damage to components or conductor tracks

Oxidation-free process during melting

Uniform, stress-free heating of the assembly

No overheating of the component or assembly to be desoldered

Reproducible process conditions

The desoldering system is ready for use again immediately after inserting new fixing pins.

No special nozzles and moulds are required for different component shapes.

The repair of lead-free products is possible without any problems