VP1100 / VP6100 vacuum

Stand-Alone system for flexible production

Features
Details

Features

The large workpiece carrier (610 x 610 mm) can be loaded flexibly. Via support rails and center supports, soldering of double-sided assemblies is also no problem.

Flexible workpiece carrier 610 x 610 mm

Allows real-time measurement of each soldering operation at product level and automatic creation and control of the soldering profile. Dynamic Profiling (Standard with VP6100) and Dynamic Profiling PLUS+ optionally available.

Sensor Based Profiling / Dynamic Profiling

Permanent filtration system installed as a standard to reduce contamination as much as possible.

Permanent Filtration Systems

The Batch System is designed for the requirements of 24/7 series operation.

Designed for 24/7 series operation

The new user interface with touch display enables easy and intuitive operation.

Intuitive operation

With the optional code scanner, product codes can be captured on the assembly and then linked to the solder profiles for traceability.

Optional: Code Scanner for Traceability

Optional: Semi-Inline version to further increase productivity

Optional: Semi-Inline

More features

Perfect solder joints thanks to the use of advanced technology
No overheating or destruction of electronic components
Low overall running costs
Robust design for serial production
Low maintenance and smooth transport

The concept

Maximum flexibility and optimum soldering quality are essential features of ASSCON stand-alone vapor phase soldering systems. By using workpiece carriers, these systems are excellently suited for small and large production quantities as well as for any design and size of assemblies. Due to their compact design, the multi-chamber systems can find a place in almost any production. The conception as batch systems allows an island production. In this way, the system can be fed from a wide variety of production stations.

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VP6100 vapor phase soldering system with Multi Vacuum

Details

VP1100

With flexibly loadable workpiece carriers and a maximum solder size of 610 x 610 mm, this system is ideally suited for both small and large product volumes.

Workpiece carrier format

610 x 610 mm

Maximum solder height

60 mm

Maximum transport clearance

100 mm

Power Supply

400 V / 3 / N / PE 50 Hz

Connection Load

9,2 kW

Average energy consumption

3,3 kWh

Oxidation-free preheating and soldering process

Continuously adjustable temperature gradient through sensor-based profiling

Optional: Dynamic Profiling and Dynamic Profiling PLUS+

Can be used in 24/7 series operation

2-Chamber-System

Low medium consumption

Internal memory of up to 500 soldering programs

Cost-effective soldering system for the highest technological requirements

VP6100 vacuum

The VP6100 is equipped with patented Multi Vacuum Technology. This reduces voids in solder joints and achieves void rates of <1%. The vacuum module, which can be switched on during the process, is located outside the soldering area (Clean Vacuum Technology) and therefore requires very little maintenance.

Workpiece carrier format

600 x 600 mm

Maximum solder height

60 mm

Maximum transport clearance

100 mm

Power Supply

400 V / 3 / N / PE 50 Hz

Connection Load

13,4 kW

Average energy consumption

3,7 kW

End vacuum (pump)

0,5 mbar

Vacuum module with Multi Vacuum technology

Dynamic Profiling as standard

Product overview