Frequently asked questions / FAQs
After completion of the soldering process, the assembly moves out of the vapor. The hot liquid film surrounding the assembly then evaporates in the cooler atmosphere without leaving any residue.
No, ASSCON uses a process medium which is chemically inert and therefore absolutely harmless to health!
- The process medium does not have to be replaced due to contamination, as it cannot be contaminated due to its inert property.
- The durability of the process medium is currently stated by the manufacturer to be over 20 years. Therefore, it is not necessary to replace the medium due to age within the service life of a plant.
The process medium used is not a hazardous substance according to the Hazardous Substances Ordinance.
With simplicity we evaluate the easy creation of soldering profiles with three parameters. That is all that is needed to create a linear profile on a vapor phase.
Due to the physically self-regulating process, no overheating of the assemblies can take place. The maximum process temperature corresponds to the boiling point of the medium used. This cannot be exceeded due to the process and is therefore safe.
In principle, the process is suitable for all products. In particular, complex and heavy assemblies with a wide range of component sizes can be soldered optimally with the vapor phase.
Basically anything that can be processed in the soft soldering process between 170 °C and 260 °C.
The vapor phase is particularly advantageous for more complex components, since here the components are heated evenly from all sides and are not subjected to “one-sided” thermal stress.
Yes, assemblies in the LED area can be soldered on the vapor phase.
Curing SMT adhesive in the vapor phase works very well. Either adhesive curing and soldering take place in the same process, or the system is set up so that the assembly is only heated to the required temperature for curing the adhesive.
The tombstone effect is not caused by vapor phase soldering, but by the mismatch of pad size and the component placed on it.
Yes, indeed. Due to the uniform condensation film on the surface of the assembly, the preheating and the actual soldering take place under exclusion of oxygen. Thus, there is no residual oxygen.
Yes, this is also possible. All profiles (linear and step profiles) can be adapted on a vapor phase soldering system.
Dynamic Profiling Plus is an update to Dynamic Profiling and supports the operator of the system in the automatic creation of soldering profiles. The parameters are parameterized automatically. This makes profiling, even of complex assemblies, very easy.
All ASSCON systems, except the VP310 and VP510, have a permanent filtration system. The process medium is continuously filtered during the soldering process, thus reducing the contamination of the system and keeping the maintenance and cleaning effort to a minimum.
No, vapor phase soldering has the biggest advantage. In most cases, a single soldering profile is sufficient for most of the soldering. However, we generally recommend working with three soldering profiles – light, medium and heavy. Light, medium and heavy each describe the actual product weight.
Absolutely. The vapor phase soldering process is highly efficient and requires only about 30% of the energy needed by a conventional convection reflow soldering system. Thus, up to 70 % of the power consumption can be saved.
No, vapor phase soldering systems and convection soldering systems require about the same amount of maintenance. Vapor phase soldering systems even have the advantage that they are still process-safe even when dirty and cannot cause any damage to the assemblies even in this case.
ASSCON offers both batch and inline systems. While batch systems with flexibly loadable workpiece carriers are used as stand-alone systems in island production, inline systems are completely integrated in the SMT line for automated production.
As is usual with convection soldering systems, the products are transported individually through the system. The use of a workpiece carrier is not necessary here.
The VP1000-66 and VP6000 batch systems and the VP2000, VP2100-100 and VP7000 inline systems are designed for series production in 24-hour operation.
The maximum product size varies depending on the machine model. The absolute maximum is 1,500 mm x 620 mm for a VP2000-310 with the Longboard option.
The throughput depends largely on the product size and the total mass introduced. Cycle times of less than 20 seconds per assembly (max. length 165 mm) are possible on a VP2000-410 dual lane system. A precise throughput calculation for your product can be requested from our sales department.
In the entry-level segment, we offer the VP310 and VP510 models, the so-called “top-loader” systems. These are characterized by flexible loading of the built-in workpiece carrier, which is loaded from the top. Hence the name Top-Loader.
- No, the VP310 and VP510 models can be operated entirely without a heavy current connection. A power supply through a 240 V connection is sufficient.
- An exhaust system is also not necessary for these models.
Both systems are batch systems. In contrast to the VP1000-66, the VP6000 is equipped with a vacuum module.
Vacuum/Multi Vacuum Technology
Almost! Void rates of < 1% are possible. Complete elimination of all shrinkage cavities by the vacuum process is technologically not possible.
The VP800 vacuum, VP6000, VP2100-100 vacuum and VP7000-200 systems can be or are equipped with a vacuum module. At present, retrofitting of this module is only offered for the VP800 and VP2100-100 systems.
It makes technological sense to achieve an end vacuum of 0.1 to 0.15 bar at an ambient pressure of 1 bar.
Over 100 systems are sold and delivered per year.
By 2021, well over 2,000 vapor phase soldering systems have been commissioned worldwide.
We manufacture exclusively at our site in Königsbrunn near Augsburg and work only with regional supplier companies.
Around 50 employees work at the Königsbrunn site.